GlobalMed, an international provider of telehealth solutions, announced today that its Chief Innovation Officer, Michael Harris, will be speaking at three major conferences this fall.
The first conference Harris will speak at is the Delivery of Things World USA 2017 in San Diego, Calif. He will lead a Challenge your peers session on Thursday, Oct. 26. The Delivery of Things World USA is the leading DevOps and Continuous Development event for senior executives who want to gain a deeper business and technical understanding of DevOps.
The second conference Harris will be presenting at is one that he is also chairing, the HEALTH:CODE Summit in Berlin, Germany. HEALTH:CODE is an international knowledge & project exchange platform bringing together 150+ trendsetters, analysts and industry experts to share their personal experiences, best practices and insider knowledge around DevOps in health. On November 27, Harris will present a case study, Driving DevOps principles deep into product designan example from telemedicine.
The third conference Harris will present at, Telco:CODE 2017, runs parallel to the HEALTH:CODE summit in Berlin. Harris will moderate a panel discussion on How is and will the IoT connectivity revolution influence our technical strategy? The session will take place on Nov. 28 and will cover Internet of Things and technical strategy in healthcare.
Telco:CODE 2017 panel members include:
Manuel Paterna, Executive Vice President of Application Integration and Innovation, Ericsson
Guillem Borrell, Post-doctoral research fellow and lecturer, University of Charles III, Madrid
Tracey Baxter, Head of Testing and Operations, UK National Health System – NES Digital Program
John Pavley, Senior Vice President Engineering, Viacom Inc.
Didier Dhaenens, Vice President of IT – DevOps, UCB
Harris is a telehealth technology expert who co-founded GlobalMed in 2002. His expertise includes: new product vision and insight; human interface and functional ID; design processes through the entire development phasefrom concepts to component features to circuit board design to 3D modeling and ID to precision manufacturing.